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CA3338M96 Supplier, CA3338M96 on Stock |
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| CA3338M96 CA3338M96 PDF The AMS2911 series develops a 1.25V reference voltage between the output and the adjust terminal. Placing a resistor between these two terminals causes a constant current to flow through R1 and down through R2 to set the overall output voltage. This current is normally the specified minimum load current of 10mA. Because IADJ is very small and constant it represents a small error and it can usually be ignored. CA3338M96 Datasheet Setting Output Voltage (VOUT) : Stepwise setting with a step of 0.1V in the range of 1.5V to 5.0V is possible. Designation of Active Type : A : active L type B : active H type Designation of Taping Type : Ex. TR, TL (refer to Taping Specifications; TR type is the standard direction.) CA3338M96 Suppliers decoder • Decodes up to four MP@ML video streams • Standard-definition output with reduced memory requirements • Simultaneous analog high-definition/standard-definition output • Dolby Digital (AC-3)/MPEG multichannel audio decoder with SPDIF output • Dual I2S bidirectional audio ports • Stereo audio DACs The SP7514 and HS3140 are precision 14-bit multiplying DACs, that provide four-quadrant multiplication. Both parts accept both AC and DC reference voltages. The SP7514 is available for use in commercial and industrial temperature ranges, packaged in a 20-pin SOIC. The HS3140 is available in commercial and military temperature ranges, packaged in a 20-pin side-brazed DIP. The Hynix CA3338M96 Series are Dual In-line Memory Modules suitable for easy interchange and addition of 128Mbytes memory. The Hynix CA3338M96 Series are fully synchronous operation referenced to the positive edge of the clock . All inputs and outputs are synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve very high bandwidth. The PZ5032C CPLDs are supported by industry standard CAE tools (Cadence, Exemplar Logic, Minc, Mentor, Synopsys, Synario, Viewlogic, OrCAD), using text (Abel, VHDL, Verilog) and/or schematic entry. Design verification uses industry standard simulators for functional and timing simulation. Development is supported on personal computer, Sparc, and HP platforms. Device fitting uses either Minc or Philips Semiconductors-developed tools. When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a vacuum tip and a force of 60 to 100 grams applied normal to the top surface of the device. When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so that its mounting pads are aligned with the circuit boards mounting pads and reflow the solder by heating the circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of the die. |
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