|
|
 |
|
|
|
CA3338D Supplier, CA3338D on Stock |
|||
| CA3338D CA3338D PDF When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a vacuum tip and a force of 60 to 100 grams applied normal to the top surface of the device. When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so that its mounting pads are aligned with the circuit boards mounting pads and reflow the solder by heating the circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of the die. CA3338D Datasheet Figure 6 shows the effects of temperature on the output current for the circuit shown in Figure 1. Figure 6 illustrates operation with the output configured for 5V. Temperature effects on the output current for VOUT = 24V operation is similar. The foldback current limiting is the result of reduced voltage on C2. The circuit delivers 50mA output current across the specified temperature range of -40oC to +85oC for all output voltages between 5V and 24V. The effect of decreasing the value of C2 (470µF) reduces the maximum output current (i.e. moves curve to the left). For all C2 values selected from Figure 4 (assuming tolerance and temperature coefficient are taken into account) the circuit meets the expected output current across the above mentioned temperature range. CA3338D Suppliers Note 16: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH). Parameter guaranteed by design. (Unless otherwise specified, these specifications apply over full operating ambient temperatures for SGR117 with -55C TA 125C, VIN - VOUT = 5.0V, and for IOUT = 500mA (K and IG), and IOUT = 100mA (T package). Although power dissipation is internally limited, these specifications are applicable for power dissipations of 2W for the T package, and 20W for the K and IG packages. IMAX is 1.5A for the K and IG packages and 500mA for the T package. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.) If a relatively large electrode surfaces are desired, and if tests show that an electrode has a high Cx capacitance that reduces the sensitivity or prevents proper operation, the electrode can be made into a mesh (Figure 1-3) which will have a lower Cx than a solid electrode area. The CA3338D is an 8-bit general purpose microcontroller especially suited for wireless telephone and battery powered applications. The CA3338D also functions as an arithmetic processor having facilities for both binary and BCD arithmetic plus bit-handling capabilities. 1. Power amplifier shall be unconditionally stable, maximum duty cycle 100%, true cw operation, maximum load mismatch and duration: VSWR = 8:1 (all phases) 10 s, ZG = 50 W, VS = 3.6 V. 2. With external matching network, load impedance 50 W. 3. Low-noise amplifier shall be unconditionally stable. 4. With external matching components. |
|
||
